Multi-Layer Systems with Widely Different Sputter Rates – Sample Preparation for TEM

Application Note for Leica EM RES102 – The multi-layer system to be prepared in cross-section consists of a Si substrate, a TiN layer with a thickness of a few nm and a 500 nm W layer. All these components have extreme differences in their hardness, their atomic weight and in their sputter rates. A preparation of this kind of samples with sample rotation would lead to a wall overlying the area of the layers.