Multilayer Systems with Widely Different Sputter Rates – Sample Preparation for TEM

http://www.leica-microsystems.com/science-lab/multilayer-systems-with-widely-different-sputter-rates-sample-preparation-for-tem/

Application Note for Leica EM RES102 – The multi-layer system to be prepared in cross-section consists of a Si substrate, a TiN layer with a thickness of a few nm and a 500 nm W layer. All these components have extreme differences in their hardness, their atomic weight and in their sputter rates. A preparation of this kind of samples with sample rotation would lead to a wall overlying the area of the layers.

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