"Shallow Trench Isolation" Structures – Sample Preparation for TEM

http://www.leica-microsystems.com/science-lab/shallow-trench-isolation-structures-sample-preparation-for-tem/

Application Note for Leica EM RES102 – The cross-sectional preparation of structured semiconductor materials requires a very thorough mechanical pre-preparation. In doing this, it must be ensured that the structure of interest should be located as close to the centre of the sample as possible. As the sample will be ion milled from both sides, a specific preparation of the structure is necessary in most cases, which means that you must thin these structures from both sides.

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